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3CEMS Capability
  • Component Capabilities
    Component Capabilities 2018-04-28
    - Solder Paste Printing - SMT (BGA, uBGA, PoP and 01005) - BGA/CSP/CBGA/CCGA/PGA Down To 140 Micron Pitch - Soldering & Flip Chip with Die Size of 0.5~50mm - COB/FOG/PoP - Multi-Chip, Chip On FPC
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  • Manufacturing Capabilities
    Manufacturing Capabilities 2018-04-22
    - Electronic Assembly - Complete Device Assembly - System Build/System Integration/Programming - Process Design & Optimization - Conformal Coating (UV-Curable) - Chip Underfill/Corner Bonding - Material Handling - Component Traceability - Test & Validation - FEMA System (PFMEA) - DFM/DFA
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  • Testing Capabilities
    Testing Capabilities 2018-04-22
    - Circuit/Functional Test - Boundary Scan - Flying Probe - 2D/3D AOI, AXI - 2D/3D X-Ray - ATE, DFT, RF, HASS - Burn In - ESD Check
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  • Service Capabilities
    Service Capabilities 2018-04-22
    - JDM (Join Design Manufacturing) - Prototype/NPI/MP - Low Volume/High Mix - Logistic - Turnkey/Sourcing - RMA
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  • Equipment Capabilities
    Equipment Capabilities 2018-04-22
    PRODUCTION EQUIPMENT Mounting Machine High Speed Machine Multi-Function Mounter Die/Wire Bonding Underfill/Glop Top Machine Reflow Machine Soldering Machine Routing Machine Ultrasonic Machine Press Fit Machine TEST EQUIPMENT PCB Appearance Check Machine Solder Paste Thickness Tester 3D SPI/AOI/ICT/X-Ray FAI Tester Flying Probe Boundary Scan RELIABILITY EQUIPMENT Burn In Room Salt Spray Tester Inte...
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A total of 1 pages

Our Services
products
  • electronics manufacturing services
    COMMUNICATION ELECTRONICS MANUFACTURING
    Communication Electronics Manufacturing Cloud Computing or Network Services are linked through network segments of Access, Aggregation, Metro & Core, or Last Mile to First Mile in Services Providers’ terminology & viewpoint. With inclusively its Precision Pick & Place Process (P4) Capabilities, Prime has been manufacturing communication products of: and is aimed to focus on the build of Access & Aggregation categories @ PCBA, Box and System levels, irrespective of wired (copper or fiber) & wireless media used.
  • automotive electronic systems manufacturing
    AUTOMOTIVE ELECTRONIC MANUFACTURING
    3CEMS Group, being an EMS provider with intensive process capabilities, is in position to build Electronic Control Units in Automotive Category such as following & not limited to: Body & Comfort, Audio & Infotainment, Power Train & Safety, HEV/EV. Manufacturing segment in automotive industry: Dashboard & LCD Monitor, Car Audio, Voice Interface, Electronic Power Steering, Head Up Display, Engine Control Unit, Vehicle Body Control Module, HVAC Control Module, Door and Mirror Control Module, Lamp Module, Vehicle Battery Management System, HEV and EV Main Inverter, DC-DC Converter, On Board Charger.
  • MEDICAL ELECTRONICS OEM
    MEDICAL ELECTRONICS OEM
    Medical Electronics Manufacturing
  • SMART BUILDING AND IoT
    SMART BUILDING AND IoT
    Looking for better smart building, IoT electronics manufacture and design solutions?
  • OEM Measurement Equipment
    TEST MEASUREMENT EQUIPMENT
    Having rich experiences to provide OEM & ODM services to famous companies for test & measurement devices manufacturing.

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Please Note: We Do Not Sell Any Electronic Products.

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