服務
三希科技集團印刷線路板事業群
線路板事業群由廣大科技,廣合科技及廣元科技組成,主營單面,雙面到多層印刷線路板及高密度線路板.十幾年的經營歲月,我們已經製造並出口過廣泛用途的各種工業之印刷電路板, 包括:資訊科技通讀,消費電子,汽車電子和保全設備等.我們採用專業技術，嚴格的品質管控標準及環境保護措施,您將期待擁有最具競爭成本和最高水準的即時服務.
產能技術
單面,雙面,多層印刷線路板及高密度連接板
印刷線路板
2009 | 2010 | 2011 | 2012 | |
Line width/Space | 3.0/3.0 mil | 2.5/2.5 mil | 2.0/2.0 mil | 2.0/2.0 mil |
PTH Hole Size (Finished) | 6mil | 6mil | 6mil | 6mil |
Max. PTH Aspect Ratio | 8:1 | 12:1 | 14:1 | 16:1 |
Min. SMT Pitch | 15.75mil | 15.75mil | 13.78mil | 13.78mil |
Impedance Control | ±10% | ±8% | ±8% | ±7% |
Max. Board Thickness | 120mil | 160mil | 180mil | 200mil |
Layer Reg. | 3.0 mil | 2.5 mil | 2.5 mil | 2.0 mil |
Green Material | Halogen Free | Middle Loss | Low Loss | Low Loss |
Max.board layers | 16 | 20 | 22 | 24 |
Surface Finish | 1.ENIG 2.OSP | |||
Layer to Layer Reg. | ±3.0 mil | ±2.5 mil | ±2.5 mil | ±2.0 mil |
S/M Reg | ±2.0 mil | ±2.0 mil | ±1.5 mil | ±1.0 mil |
Min. Thickness of 4L | 12mil | 12mil | 10mil | 10mil |
Min. Thickness of 8L | 25mil | 22mil | 20mil | 20mil |
Min.Thickness of 12L | 37mil | 34mil | 32mil | 32mil |
高密度連接板
用於不同的特性結合所帶來的數種益處,經由增加密度而降低單位成本使得產品小型化,並增加傳輸速度.
2009 | 2010 | 2011 | 2012 | |
Line width/Space | 3.0/3.0 mil | 2.5/2.5 mil | 2.0/2.0 mil | 2.0/2.0 mil |
Min. Micro Via (Unfinished) | 4.0mil | 3.5mil | 3.5mil | 3.0mil |
Max. Micro Via Aspect Ratio | 0.8:1 | 0.9:1 | 1:1 | 1:1 |
Min. Micro Via Pad | 11mil | 10mil | 10mil | 10mil |
Impedance Control | ±10% | ±8% | ±8% | ±7% |
Layer to Layer Reg | ±3.0 mil | ±2.5 mil | ±2.5 mil | ±2.0 mil |
S/M Reg | ±2.0 mil | ±2.0 mil | ±1.5 mil | ±1.0mil |
Min.Build-up Dielectric Thickness | 3.0mil | 2.5mil | 2.0mil | 2.0mil |
Max. Build-up | 2 | 3 | 4 | 4 |
環境保護
環境污染防治在PCB製造過程為及其重要一環,我們與國際大廠均有綠色合作,三希科技對環境保護,永續經營的承諾深植於核心價值之經營理念.
