
Services
About Broad Technology
- Broad Technology(BTI) is established by 3CEMS group as the PCB business unit. It is consisted of 3 plants located in China: Broad Technology, Delton Electronics and Broadteam Electronics. The main products focus on 2 to 22 layers bare PCB and HDI PCB. The strength of BTI lies in our full study of what the customers' needs and the stringent quality requirement. We then provide the products with the core value of high reliability, on time delivery and responsive after-sale service. Environment protection is also considered carefully in BTI. We carefully control the wastage from every process of production, and we follow the international regulation to avoid the electronic manufacturing effects against the earth.
Technology Roadmap
BTI manufactures bare PCB from 2 layers to 16 layers, and HDI PCB.
Bare PCB
2009 | 2010 | 2011 | 2012 | |
Line width/Space | 3.0/3.0 mil | 2.5/2.5 mil | 2.0/2.0 mil | 2.0/2.0 mil |
PTH Hole Size (Finished) | 6mil | 6mil | 6mil | 6mil |
Max. PTH Aspect Ratio | 8:1 | 12:1 | 14:1 | 16:1 |
Min. SMT Pitch | 15.75mil | 15.75mil | 13.78mil | 13.78mil |
Impedance Control | ±10% | ±8% | ±8% | ±7% |
Max. Board Thickness | 120mil | 160mil | 180mil | 200mil |
Layer Reg. | 3.0 mil | 2.5 mil | 2.5 mil | 2.0 mil |
Green Material | Halogen Free | Middle Loss | Low Loss | Low Loss |
Max.board layers | 16 | 20 | 22 | 24 |
Surface Finish | 1.ENIG 2.OSP | |||
Layer to Layer Reg. | ±3.0 mil | ±2.5 mil | ±2.5 mil | ±2.0 mil |
S/M Reg | ±2.0 mil | ±2.0 mil | ±1.5 mil | ±1.0 mil |
Min. Thickness of 4L | 12mil | 12mil | 10mil | 10mil |
Min. Thickness of 8L | 25mil | 22mil | 20mil | 20mil |
Min.Thickness of 12L | 37mil | 34mil | 32mil | 32mil |
HDI PCB
2009 | 2010 | 2011 | 2012 | |
Line width/Space | 3.0/3.0 mil | 2.5/2.5 mil | 2.0/2.0 mil | 2.0/2.0 mil |
Min. Micro Via (Unfinished) | 4.0mil | 3.5mil | 3.5mil | 3.0mil |
Max. Micro Via Aspect Ratio | 0.8:1 | 0.9:1 | 1:1 | 1:1 |
Min. Micro Via Pad | 11mil | 10mil | 10mil | 10mil |
Impedance Control | ±10% | ±8% | ±8% | ±7% |
Layer to Layer Reg | ±3.0 mil | ±2.5 mil | ±2.5 mil | ±2.0 mil |
S/M Reg | ±2.0 mil | ±2.0 mil | ±1.5 mil | ±1.0mil |
Min.Build-up Dielectric Thickness | 3.0mil | 2.5mil | 2.0mil | 2.0mil |
Max. Build-up | 2 | 3 | 4 | 4 |
Quality
Quality is everyday. We understand the customers' strict requirement for the quality in this industry. We establish a corporate culture that embraces and produce the exquisite ability at every level of our quality control system.
ISO9001:2004 | ISO14001:2008 | QC080000 | TS16949 | |
Broad Technology |
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Delton Electronics | ||||
Broadteam Electronics |
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