About Broad Technology

  • Broad Technology(BTI) is established by 3CEMS group as the PCB business unit. It is consisted of 2 plants located in China: Broad Technology and Broadteam Electronics. The main products focus on 2 to 22 layers bare PCB and HDI PCB. The strength of BTI lies in our full study of what the customers' needs and the stringent quality requirement. We then provide the products with the core value of high reliability, on time delivery and responsive after-sale service. Environment protection is also considered carefully in BTI. We carefully control the wastage from every process of production, and we follow the international regulation to avoid the electronic manufacturing effects against the earth.

 

 

Technology Roadmap

BTI manufactures bare PCB from 2 layers to 16 layers, and HDI PCB.

Bare PCB                                                                                                             

2014

2015

2016

2017

Line width/Space

3.0/3.0 mil

3.0/3.0 mil

3.0/3.0 mil

2.5/2.5 mil

PTH Hole Size (Finished)

6mil

6mil

6mil

6mil

Max. PTH Aspect Ratio

10:1

10:1

12:1

14:1

Min. SMT Pitch

15.75mil

15.75mil

15.75mil

13.78mil

Impedance Control

±8%

±8%

±8%

±7%

Max. Board Thickness

110mil

110mil

120mil

130mil

Layer Reg.

3.0 mil

2.5 mil

2.5 mil

2.0 mil

Green Material

Halogen Free 
Lead Free   

Middle Loss

Low Loss

Low Loss

Max.board layers

16

16

16

20

Surface Finish

1.ENIG             2.OSP
3.Imm T&S     
 4.Gold Plating     
5.L-F HASL      
 6.Selective Ni / Au 

Layer to Layer  Reg.

±3.0 mil

±2.5 mil

±2.5 mil

±2.0 mil

S/M Reg

±2.0 mil

±2.0 mil

±2.0 mil

±1.5 mil

Min. Thickness of 4L

12mil

12mil

12mil

10mil

Min. Thickness of 8L

25mil

22mil

22mil

20mil

Min.Thickness of 12L

37mil

34mil

34mil

32mil

HDI PCB                                                              

2014

2015

2016

2017

Line width/Space

3.0/3.0 mil

2.5/2.5 mil

2.0/2.0 mil

2.0/2.0 mil

Min. Micro Via (Unfinished)

4.0mil

3.5mil

3.5mil

3.0mil

Max. Micro Via Aspect Ratio 

0.8:1

0.9:1

1:1

1:1

Min. Micro Via Pad

11mil

10mil

10mil

10mil

Impedance Control

±10%

±8%

±8%

±7%

Layer to Layer Reg

±3.0 mil

±2.5 mil

±2.5 mil

±2.0 mil

S/M Reg

±2.0 mil

±2.0 mil

±1.5 mil

±1.0mil

Min.Build-up Dielectric Thickness

3.0mil

2.5mil

2.0mil

2.0mil

Max. Build-up

2

3

4

4

 

 

Quality 

Quality is everyday. We understand the customers' strict requirement for the quality in this industry. We establish a corporate culture that embraces and produce the exquisite ability at every level of our quality control system. 

ISO9001:2004ISO14001:2008QC080000TS16949
Broad TechnologyVV V
Broadteam ElectronicsVV V

 

 Environment Protect

BTI is partnership with big brand names for green activities, clikc the below pictures to see our certificates.