| HDI
substrate, applied in different feature combinations brings several
benefits; miniaturization of products, improved speed and lowered
costs through increased density and price per connection. |
Other
features include :
|
1. Additive
technology over a deposited resin surface. High precision permanent
resists
enable 50 micron and below lines and spaces.
|
2. Blind
microvias (in-pad), 50 microns and less, are the key wiring-density
enhancement
which differentiates HDI substrates from conventional PC
boards.
|
|
Our HDI/BGA
capabilities boasts of :
|
| |
2005 |
2006 |
2007 |
2008 |
2009 |
| Products |
2005 |
2006 |
2007 |
2008 |
2009 |
| Line/Space |
4/4 mil |
3/3 mil |
2.5/2.5 mil |
2.0/2.0 mil |
1.5/1.5 mil |
| Micro Via(D) |
6 mil |
4 mil |
3 mil |
2 mil |
|
| Surface
Finish |
Immersion Ni/Au |
Entek |
|
Immersion Tin |
|
| Selective Ni/Au |
| Green Material |
|
Halogen Free |
Lead Free |
|
|
| Layer Reg. |
5 mil |
4 mil |
3 mil |
2 mil |
|
| Products |
PBGA, uBGA, CSP, RF
Module, MCM - L |
| Line/Space |
|
3/3 mil |
2/2.5 mil |
1.5/1.5 mil |
1.2/1.2 mil |
| Green Material |
|
Halogen Free |
Lead Free |
|
|
| Surface Finish |
|
Soft Gold |
|
|
|
| |
| Capability (
HDI /BGA) |
| Description |
Unit |
2006 |
2007 |
2008 |
2009 |
| Max. build-up
layer count per side |
|
layers |
2 |
3 |
3 |
3 |
| Min. build-up
dielectric thickness |
|
mil |
2.6 |
2.2 |
2 |
1.5 |
| Min. micro via
diameter (Unfinished) |
|
mil |
4 |
4 |
3 |
3 |
|
|
mil |
12 |
12 |
10 |
10 |
| Max. micro via
aspect ratio |
|
|
0.8:1 |
0.8:1 |
0.9:1 |
01:01 |
|
|
mil |
3月3日 |
2.5/3 |
2.5/2.5 |
2月2日 |
| Layer to layer
Reg. Tolerance |
|
mil |
3.5 |
3 |
2.5 |
2 |
| Solder Mask Reg.
Tolerance |
|
mil |
1.5 |
1.5 |
1.25 |
1 |
|
|
% |
±8 |
±8 |
±7 |
±7 |
|
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
|
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
|
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
| |
| Equipment |
| Process |
Equipment |
Brand |
Model No. |
Quantity |
|
| Design |
Laser Plotter. |
ORBOTEC |
RG000 |
1 |
|
| Image Transfer |
Copper Reduction Line. |
H |
LT-910229 |
1 |
|
| Image Transfer |
Laminator(D/F). |
TCM |
HLM-A60-T |
9 |
|
| Image Transfer |
Automatic DES Line. |
HITACHI |
LT-910350 |
3 |
|
| Image Transfer |
Automatic Optical Inspector. |
TCM |
SK-95 |
16 |
|
| Image Transfer |
Fully Auto-Exposure System. |
ORBOTEC |
EXP-2050 |
9 |
|
| Lamination |
Fully Automatic Mass |
H |
AIKI |
2 |
|
| Lamination Lay-Up
System. |
|
| Lamination |
Vacuum Hot-Oil Press System. |
ORC |
S020907 |
5 |
|
| Lamination |
Automatic Black-Oxide |
AIKI |
LT-910355 |
3 |
|
| Treatment Line. |
|
| Drilling |
Plasma Etcher. |
KITAGAWA |
PCB 2800E |
2 |
|
| Drilling |
CO2 Laser Drilling Machine. |
ATO |
LC-2F 21BE/1C |
9 |
|
| Drilling |
CNC Drilling Machine. |
MARCH |
ND-6N210E/M30D |
30 |
|
| Copper
Plating |
Automatic Horizontal |
HITACHI |
ATO |
2 |
|
| Desmear PTH Plating
Line. |
|
| S/M |
Automatic Electrostatic |
HITACHI |
SPRAY COATER |
1 |
|
| Spray Coating Machine. |
|
| S/M |
Fully Auto Exposure |
ATO |
ORC-2001B |
3 |
|
| (S/M) Machine. |
|
| Final Treatment |
Immersion Gold Line. |
FUJI |
PAT |
2 |
|
| Final
Treatment |
CNC Routing Machine. |
ORC |
NR-6F210E |
7 |
|
| PAT |
|
| HITACHI |
|
|
|
|
|
|
|
|
Capabilities for PCB 10L and above |
| Description |
|
2006 |
2007 |
2008 |
2009 |
| PTH Hole Size (Finished) |
mil |
6 |
6 |
4 |
4 |
| Max. PTH aspect ratio |
|
09:01 |
09:01 |
10:01 |
10:01 |
| Line / Space |
mil |
3月3日 |
2.5/3 |
2.5/2.5 |
2月2日 |
| Min. SMT pitch |
mil |
8 |
7 |
7 |
6 |
| Layer to layer Reg.
Tolerance |
mil |
3.5 |
3 |
2.5 |
2 |
| Solder Mask Reg.
Tolerance |
mil |
1.5 |
1.5 |
1.25 |
1 |
| Impedance control |
% |
±8 |
±8 |
±7 |
±7 |
| Board flatness tolerance |
% |
0.7 |
0.6 |
0.5 |
0.4 |
| Min. board thickness of
4 layers |
mil |
14 |
12 |
12 |
10 |
| Min. board thickness of
8 layers |
mil |
27 |
25 |
22 |
20 |
| Min. board thickness of
12 layers |
mil |
41 |
37 |
34 |
32 |
| Max. board thickness |
mil |
100 |
110 |
120 |
120 |
HDI
/ BGA