HDI substrate, applied in different feature combinations brings several benefits; miniaturization of products, improved speed and lowered costs through increased density and price per connection.
Other features include :
1. Additive technology over a deposited resin surface. High precision permanent resists enable 50 micron and below lines and spaces.
2. Blind microvias (in-pad), 50 microns and less, are the key wiring-density enhancement which differentiates HDI substrates from conventional PC boards.
Our HDI/BGA capabilities boasts of :
|
2005 |
2006 |
2007 |
2008 |
2009 |
| Products |
PCMCIA, 14 Layers, Blind Via, HDI(Blind/Buried) |
| Line/Space |
4/4 mil |
3/3 mil |
2.5/2.5 mil |
2.0/2.0 mil |
1.5/1.5 mil |
| Micro Via(D) |
6 mil |
4 mil |
3 mil |
2 mil |
|
| Surface Finish |
Immersion Ni/Au
Selective Ni/Au |
Entek |
|
Immersion Tin |
|
| Green Material |
|
Halogen Free |
Lead Free |
|
|
| Layer Reg. |
5 mil |
4 mil |
3 mil |
2 mil |
|
| Products |
PBGA, uBGA, CSP, RF Module, MCM - L |
| Line/Space |
|
3/3 mil |
2/2.5 mil |
1.5/1.5 mil |
1.2/1.2 mil |
| Green Material |
|
Halogen Free |
Lead Free |
|
|
| Surface Finish |
|
Soft Gold |
|
|
|
|
|
|
|
|
|
| Capabilities for PCB 10L and above |
Description |
|
2006 |
2007 |
2008 |
2009 |
| PTH Hole Size (Finished) |
mil |
6 |
6 |
4 |
4 |
| Max. PTH aspect ratio |
|
9:1 |
9:1 |
10:1 |
10:1 |
| Line / Space |
mil |
3/3 |
2.5/3 |
2.5/2.5 |
2/2 |
| Min. SMT pitch |
mil |
8 |
7 |
7 |
6 |
| Layer to layer Reg. Tolerance |
mil |
3.5 |
3 |
2.5 |
2 |
| Solder Mask Reg. Tolerance |
mil |
1.5 |
1.5 |
1.25 |
1 |
| Impedance control |
% |
±8 |
±8 |
±7 |
±7 |
| Board flatness tolerance |
% |
0.7 |
0.6 |
0.5 |
0.4 |
Min. board thickness of 4 layers |
mil |
14 |
12 |
12 |
10 |
| Min. board thickness of 8 layers |
mil |
27 |
25 |
22 |
20 |
| Min. board thickness of 12 layers |
mil |
41 |
37 |
34 |
32 |
| Max. board thickness |
mil |
100 |
110 |
120 |
120 |
|
Capability ( HDI /BGA)
|
Description |
Unit |
2006 |
2007 |
2008 |
2009 |
 Max. build-up layer count per side
|
layers |
2 |
3 |
3 |
3 |
 Min. build-up dielectric thickness
|
mil |
2.6 |
2.2 |
2 |
1.5 |
 Min. micro via diameter (Unfinished)
|
mil |
4 |
4 |
3 |
3 |
 Min. micro via pad
|
mil |
12 |
12 |
10 |
10 |
 Max. micro via aspect ratio
|
|
0.8:1 |
0.8:1 |
0.9:1 |
1:1 |
 Line / Space
|
mil |
3/3 |
2.5/3 |
2.5/2.5 |
2/2 |
 Layer to layer Reg. Tolerance
|
mil |
3.5 |
3 |
2.5 |
2 |
 Solder Mask Reg. Tolerance
|
mil |
1.5 |
1.5 |
1.25 |
1 |
 Impedance control
|
% |
±8 |
±8 |
±7 |
±7 |
 Via on PTH
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
 Via on Via
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
 Plugged Plating
|
Yes/No |
Yes |
Yes |
Yes |
Yes |
|
Equipment
Process |
Equipment |
Brand |
Model No. |
Quantity |
Design |
Laser Plotter. |
ORBOTEC |
RG000 |
1 |
Image Transfer |
Copper Reduction Line. |
H |
LT-910229 |
1 |
Image Transfer |
Laminator(D/F). |
TCM |
HLM-A60-T |
9 |
Image Transfer |
Automatic DES Line. |
HITACHI |
LT-910350 |
3 |
Image Transfer |
Automatic Optical Inspector. |
TCM |
SK-95 |
16 |
Image Transfer |
Fully Auto-Exposure System. |
ORBOTEC |
EXP-2050 |
9 |
Lamination |
Fully Automatic Mass
Lamination Lay-Up System. |
H |
AIKI |
2 |
Lamination |
Vacuum Hot-Oil Press System. |
ORC |
S020907 |
5 |
Lamination |
Automatic Black-Oxide
Treatment Line. |
AIKI |
LT-910355 |
3 |
Drilling |
Plasma Etcher. |
KITAGAWA |
PCB 2800E |
2 |
Drilling |
CO2 Laser Drilling Machine. |
ATO |
LC-2F 21BE/1C |
9 |
Drilling |
CNC Drilling Machine. |
MARCH |
ND-6N210E/M30D |
30 |
Copper Plating |
Automatic Horizontal
Desmear PTH Plating Line. |
HITACHI |
ATO |
2 |
S/M |
Automatic Electrostatic
Spray Coating Machine. |
HITACHI |
SPRAY COATER |
1 |
S/M |
Fully Auto Exposure
(S/M) Machine. |
ATO |
ORC-2001B |
3 |
Final Treatment |
Immersion Gold Line. |
FUJI |
PAT |
2 |
Final Treatment |
CNC Routing Machine. |
ORC
PAT
HITACHI |
NR-6F210E |
7 |
|
HDI / BGA