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3CEMS About

About 3CEMS Locations


3CEMS has 2 locaitons in Mainland China and 1 location in Taiwan. Business focuses on EMS, Joint Design Electronic Manufacturing and vertically integrated our experience and resource to provide our customers the professional manufacturing services. Our facilities in Southern China are harmoniously orchestrated and monitored to ensure that work performed for our clients meet global standards of quality and efficiency.  


Prime Technology(Guangzhou) Inc. /Prime Base Inc.

Year Built: 1997

Area: 22,500m2 / 242,188 sq. ft



EMS Business Unit

Main Product: Join Design, PCBA and Box Build for Automotive, Industrial, Communication, Maritime,Medical, Consumer Electronics.

Current Production Lines: 12 SMT / 11 MI / 8 Assembly

SMT Capacity: 1.35kkk/m

Assembly Capacity: 240k/m

MI Capacity: 600k/m


3CEMS Group PRIME BASE


3CEMS PRIME


OE Business Unit

Main Product:  Optical Communication Electronics Manufacturing

Current Production Lines: 3 SMT

Assembly Capacity: 900k/M


The OE Business Unit is mainly focused on the optical module PCB Assembly. It has cooperated with top optical module companies at domestic and international for many years with accumulated a series of advanced production experience in optical module PCBA industry.

Since 2007, the OE Business Unit has been producing low-level optical module PCBA such as SFP, SFF, XFP, etc. Until now, it has covered all optical module packaging types, such as CFP, SFP+, TXFP, QSFP28, QSFP56, OSFP, QSFPDD, etc., with a wealth of experience in 01005 chip mount, COB area protection, 37030LGA process, FPCB, BGA, under fill, part encapsulation, 0201 part coating and other process capabilities.


3CEMS


3CEMS QA


Amertek Computer

Year Built: 1994

Area: 60,977m2

Capital: USD19.2M

Main Product: PCBA, SSD, RAM, PC System, Mini PC System, AIO

Current Production Lines: 25 SMT / 3 Assembly / 10 MI

SMT Capacity: 2.57kkk/m

Assembly Capacity: 78k/m

MI Capacity: 1092k/m


3CEMS Amertek Computer


Equipment

PCB assembly, SMT, SPI / 2D 3D AOI, X-Ray, Auto Insertion Lines, FPCBA, Conformal Coating, ICT/ATE, Box-Build, Run In process / Burn In Room


QC080000, X-Ray Analytical Microscope / ICP-OES, QA inspection & Reliability Test, IQC Inspection Equipment List, 2.5D & 5D X-Ray, 3D SPI, Vibration Tester, Salt Spray Tester, Boundary Scan, Flying Probe.


2.5D Projector, X-Ray Fluorescence Spectrometers, V-Cut Thickness Gauge, High Gauge And Marble Platform, Bore Gauge, Microscope, Magnifier, Caliper, Digital Gauss Meter, Digital Micro Meter, Wood moisture Meter, Rubber Sclerometer, LCR Meter, Insulation Resistance Tester.


3CEMS SMT


3CEMS DIP Line


3CEMS COB Chamber


3CESM System Assembly





Logwell Technology

Year Built: 1997

Employees: 250

Capital: USD2M

【Plant 1】Two Floors with 2,500 Sq. Meter No. 254, Sec. 3, Datong Rd., XizhiDist., New Taipei City 221, Taiwan

【Plant 2】No. 46, Ln. 56, Da’anSt., XizhiDist., New Taipei City 221, Taiwan

Main Product & Service: Join Design, PCBA and Box Build for Industrial, Communication, Consumer Electronics and Optical Communication Business Unit. OEM/ODM for Compute Appliance & GPS Solution, SMT、DIP、Function Test and Finish Good Assembly. IC design and Firmware develop for Controller. Consultant for Product Researching, Developing on Computing,Communication Network  Sample Service

Current Production Lines: 4 SMT / 2 MI / 2 Assembly

SMT Capacity: 7.25kk/m

Assembly Capacity: 50k/m

MI Capacity: 200k/m






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