Solder Paste Printing SMT BGA/uBGA/PoP SMT 01005, 008004 BGA/CSP/CBGA CCGA/PBGA (down to 0.27mm pitch) Flip Chip with die size of 0.5~50mm COB, PoP, Multi-Chip (SMT+COB for 800G/1.6T with minimum 0.110mm pitch) Chip on FPC Component Traceability

PCB Assembly/Box-Build IPXX Assembly System Build/System Integration/Programming Die Bonding/Wire Bonding Selective Wave Soldering Conformal Coating (UV-Curable) Chip Underfill/Glob Top Ultrasonic Welding/Laser Marking FMEA System (PFMEA)

Circuit/Functional Test by JTAG Boundary Scan Flying Probe 2D/3D AOI, AXI 2D/3D X-ray ATE, DFT, RF, HASS, Burn in, ESD Check Hi-Pot Test

JDM (Join Design Manufacturing) Prototype/NPI/MP Low Volume/High Mix Logistic Turnkey/Sourcing RMA

PRODUCTION EQUIPMENT (SMT+DIP+Assy) Mounting Machine High Speed Machine Multi-Function Mounter Die/Wire Bonding Underfill/Glop Top Machine Reflow Machine Soldering Machine Routing Machine Ultrasonic Machine Press Fit Machine TEST EQUIPMENT PCB Appearance Check Machine Solder Paste Thickness Tester 3D SPI/AOI/ICT/X-Ray FAI Tester Flying Probe Boundary Scan RELIABILITY EQUIPMENT Burn In Room Sa...