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3CEMS Group Attended 10th CAIF 2021-06-30


The 10th Civil Avionics International Forum was grand open on June 22th in the Chateau Star River Minhang, Shanghai. As an exhibitor, 3CEMS Group Prime Technology was invited to participate and showcase the potential manufacturing capability and service for Avionics and Aerospace Industry. With the theme of "Focus on the Intelligent Development of Aircraft Avionics Systems", the Forum discussed the digitization of aircraft avionics systems and equipment by focusing on the strengthening of the weaknesses and foundations of the avionics industry supply chain. The Forum set up a number of thematic discussions and interactive seminars.  Nearly 50 domestic and foreign leaders, academicians, experts and scholars in the field of aircraft avionics are invited to make presentations.



Civil Avionics is a high specific, high added value industry. As an enterprise that made an important achievement in the field of automotive electronic, maritime electronics, telecommunication electronics and medical electronics, entering this domain is one of the most key strategic development goals of 3CEMS Group. In the node of going through the final audit of AS9100 Certificate, this is second time being attended in such high profile activity and platform for 3CEMS Group. The participants listened to the report of experts and scholars to learn and understand the relevant industry knowledge. For the better understanding of aviation electronic supply chain, aviation electronics manufacturing, airworthiness approval system, commercial aircraft avionics system, general aircraft avionics system, it has a great helpful for the enterprise future business development.

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    Communication Electronics Manufacturing Cloud Computing or Network Services are linked through network segments of Access, Aggregation, Metro & Core, or Last Mile to First Mile in Services Providers’ terminology & viewpoint. With inclusively its Precision Pick & Place Process (P4) Capabilities, Prime has been manufacturing communication products of: and is aimed to focus on the build of Access & Aggregation categories @ PCBA, Box and System levels, irrespective of wired (copper or fiber) & wireless media used.
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