- Solder Paste Printing
- SMT BGA/uBGA/PoP
- SMT 01005, 008004
- BGA/CSP/CBGA CCGA/PBGA (down to 0.27mm pitch)
- Flip Chip with die size of 0.5~50mm
- COB, PoP, Multi-Chip (SMT+COB for 800G/1.6T with minimum 0.110mm pitch)
- Chip on FPC
- Component Traceability
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