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3CEMS Capability
Equipment Capabilities 2025-05-25



PRODUCTION EQUIPMENT (SMT+DIP+Assy)

  • Mounting Machine
  • High Speed Machine
  • Multi-Function Mounter
  • Die/Wire Bonding
  • Underfill/Glop Top Machine
  • Reflow Machine
  • Soldering Machine
  • Routing Machine
  • Ultrasonic Machine
  • Press Fit Machine



TEST EQUIPMENT

  • PCB Appearance Check Machine
  • Solder Paste Thickness Tester
  • 3D SPI/AOI/ICT/X-Ray
  • FAI Tester
  • Flying Probe
  • Boundary Scan



RELIABILITY EQUIPMENT

  • Burn In Room
  • Salt Spray Tester
  • Integrating Sphere
  • Temperature & Humidity Chamber
  • Vibration Tester
  • Thermal Shock
  • Drop Tester
  • ESD Simulator
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Please Note: We Do Not Sell Any Electronic Products.

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