- Solder Paste Printing - SMT (BGA, uBGA, PoP and 01005, 008004) - BGA/CSP/CBGA/CCGA/PGA Down To 0.27mm - Soldering & Flip Chip with Die Size of 0.5~50mm - COB/FOG/PoP - Multi-Chip, Chip On FPC

- PCB Assembly/Box-Build IPXX Assembly - System Build/System Integration/Programming - Die Bonding/Wire Bonding - Selective Wave Soldering - Conformal Coating (UV-Curable) - Chip Underfill/Glob Top - Ultrasonic Welding/Laser Marking - FMEA System (PFMEA)

- Circuit/Functional Test by JTAG - Boundary Scan - Flying Probe - 2D/3D AOI, AXI - 2D/3D X-ray - ATE, DFT, RF, HASS, Burn in, ESD Check - Hi-Pot Test

- JDM (Join Design Manufacturing) - Prototype/NPI/MP - Low Volume/High Mix - Logistic - Turnkey/Sourcing - RMA

PRODUCTION EQUIPMENT (SMT+DIP+Assy) Mounting Machine High Speed Machine Multi-Function Mounter Die/Wire Bonding Underfill/Glop Top Machine Reflow Machine Soldering Machine Routing Machine Ultrasonic Machine Press Fit Machine TEST EQUIPMENT PCB Appearance Check Machine Solder Paste Thickness Tester 3D SPI/AOI/ICT/X-Ray FAI Tester Flying Probe Boundary Scan RELIABILITY EQUIPMENT Burn In Room Sa...